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Help with identifying functional equivalents, and solutions that work for customer circuits.
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DC to 50Amps and 1000V.Assembly including die attach, wire bonding Au (ball) and Al (wedge hermetic sealing, seam sealing, metal cans, ceramic or plastic packages as required.Build and Test of Circuit Boards and Card Assemblies.Copyright 2017 Fiore Industries Inc, zircon - This is a europa casino no deposit bonus codes 2015 contributing Drupal Theme.Wafer saw and singulation of GaAs, Silicon, and Sapphire based components.MHC performs burn-in, centrifuge, temp cycle.Visual inspection from gross visual to mil std 883/750 condition A (space level) or B (military level).MHC has been mil-45208 audited as well. Pick and place services to provide end product in waffle pack, gel pack or tape and reel.Good suppliers are dedicated to their customers end product and MHC pledges to support our customers and continually improve our processes towards the goal of perfect quality and delivery performance).The Fiore laboratory provides low-rate production/high-quality prototyping.

Wafer polishing, back lapping.
MHC is dedicated to providing quality product and maintains ISO 9001:2008 certification.
Assistance with design, redesign and alternative sourcing.Please place your order by phone or e-mail 2011-14 Altamont 1474 Grass Valley Highway Auburn,.LAT testing to 38534 class K and H or to customer supplied drawings or specifications.MHC can provide PAL, prom and eprom programming and testing.Wafer probing at 25C/-55C/125C.DC and AC parametric functionality tests.Service offered to hybrid, MCM (multi-chip module) and COB (chip on board) designers and manufacturers.MHC can perform a wide range of electrical testing from 65C to 200C.MHC can perform SEM and wlat cross section analysis.